Semiconductor Package Design Engineer
Company: Micross
Location: Apopka
Posted on: February 16, 2026
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Job Description:
Job Description Job Description Micross is seeking a
Semiconductor Package Design Engineer for our onsite facility in
Apopka, Florida. Essential Duties and Responsibilities: The
primarily responsible for design of advanced semiconductor
packages, including both ceramic and organic substrates, including
layout, parasitic extraction, and optimization Work with IC design,
system design, package Signal Integrity (SI)/Power Integrity (PI) &
thermal engineering teams to design custom interposer and
substrates Work with SoC design teams to optimize die floorplan,
bump patterns and interposer / substrate stack up Work with IC
design team to define IC package requirements Design package layout
using standard CAD tools Extract package parasitics and conduct
PI/SI analysis Documentation and release in appropriate archival
system Preferred Knowledge, Skills, And Abilities Layout: Allegro
Package Designer Plus (APD) tools for designing the package and
generating artwork for fabrication. Analysis: Celsius PowerDC (IR
Drop) Sigrity Advanced SI II: Analysis tools for Signal integrity
of parallel busses (DDRx) and serial links (PCIe Gen x), including
Package and PCB effects Sigrity Advanced PI II: Power Integrity
tools (IR drop, Impedance Profile, capacitor optimization)
including Package and PCB effects RF / Microwave Design AWR,
Momentum and HFSS Software Circuit, system, and EM simulation for
RF/microwave product development Qualifications Bachelors degree in
Electrical Engineering, Mechanical Engineering, or other
semiconductor packaging related discipline. 8 to 10 years of
experience in semiconductor packaging design, modeling, and
simulations Strong authority on Cadence Allegro Package Designer
Plus (APD) Experience on interposer and substrate layouts and
design in advanced package technologies Experience with 2.5D, 3D
package design Experience with design teams on floor plan, bump and
layout optimization Excellent skills in problem solving, written
and verbal communication, excellent organization skills, and highly
self-motivated Record of success in cross-functional team
environment Good experience with SI/PI tools for package level
extraction/simulation At Micross, our Core Values of integrity,
communication, teamwork, quality and execution, self-discipline and
accountability are cultivated throughout all levels of the
organization. Micross provides a challenging and enjoyable
workplace for members and supports the needs of the community.
Micross provides competitive benefits including medical, HSA and
FSA plans, dental, vision, company paid basic Life Insurance,
Employee Assistance Program (EAP), 401k with employer match, paid
leave, vacation, holidays, generous tuition assistance, 529 College
Savings, Pet insurance, Legal insurance, and a range of well-being
programs available. www.Micross.com
Keywords: Micross, Port Orange , Semiconductor Package Design Engineer, Engineering , Apopka, Florida
